ULi: Application of Laser Soldering Machine in 3C Electronics Industry

With the improvement of IC chip design level and manufacturing technology, electronic products are developing towards the direction of high density, high reliability and miniaturization. At present, the QFP pin center distance has reached 0.3mm, a single device pin number can reach more than 576.This makes the traditional soldering machine welding methods such as gas phase reflow welding, hot air reflow welding and infrared reflow welding in the welding of such fine-spacing components, easy to occur adjacent lead solder joint "bridge ".At the same time, the base material of the traditional soldering machine can not withstand too high temperature .In this way, the traditional artificial soldering iron welding, reflow welding and other technologies have been unable to adapt to the production of such materials.

 

Application advantage of laser soldering machine in 3C industry

Laser soldering technology is to separate a single tin ball, through the combined action of laser and inert gas, a certain temperature of molten tin liquid droplets to the metallized solder pad accurately sprayed to the surface of the area to be welded, using the heat carried by the tin ball droplets to heat the solder pad to form a convex or bonding .The main advantage of this technology is that it can realize the interconnection of very small size, the droplet size can be as small as tens of microns; The tin ball distribution and heating process are carried out at the same time, and the production efficiency is high. Through the digital control of the tin ball, the precise control of the spray position can be realized, so as to realize the interconnection of the minimum distance. The heating of the tin ball droplet is local and has no thermal effect on the whole package. In addition, there is no tool contact during the connection process, which avoids the device surface damage caused by the contact between the tool and the device surface, which is a new microelectronic packaging and interconnection technology. Therefore, laser soldering technology has a very wide application prospect in the production of the core components of 3C products.

 

Characteristics of welding system of laser soldering machine

 

The development of laser soldering machine welding system can greatly reduce the cost of domestic electronic processing enterprises and upgrade the technology. The domestic promotion of the national electronic information industry is conducive to the promotion of Industry 4.0 and 2025 intelligent manufacturing strategy.

 

The welding system of laser soldering machine adopts multi-axis intelligent working platform, equipped with synchronous CCD vision detection system positioning and monitoring system, which can effectively guarantee the welding precision and good product rate .Adopts the tin ball jet welding, the welding precision is high, the quality is reliable through the slice experiment 99.8% no weld, some for the temperature is very sensitive or the soft plate connection welding area, can effectively guarantee the welding precision and the high quality solder joint, the tin ball application range is 350um~760um.Adopt general clamping equipment, product replacement is easy.